Detecting Ceramic Substrate Packaging Defects with X-ray
Encapsulation is the key process in manufacturing optoelectronic devices, which directly affects the performance, reliability, and cost of the devices. Currently, there are no national or industry sta...
14 Mar,2023
Development and Applications of X-ray Examination Technology
X-ray inspection is a non-destructive testing method that uses X-rays to penetrate materials and detect defects in the workpiece by the attenuation characteristics in the material. With the developmen...
07 Mar,2023
X-ray Inspection Equipment Boosts the Development of the Automotive Industry
Nowadays, the automotive industry is developing towards intelligence and electrification. With the maturity of car networking technology, smart cars, autonomous driving, and new energy vehicles have b...
28 Feb,2023
The Difference Between Infrared BGA Rework Station and Hot Air BGA Rework Station
Infrared BGA rework station is different from hot air BGA rework station in that infrared heating is generally used for two-temperature zone BGA rework stations, while hot air BGA rework stations use ...
21 Feb,2023
Introduction of Ball Planting Method in BGA Rework System
1. BGA rework system template ball planting methodPlace the BGA device printed with flux or solder paste on the workbench, with the flux or solder paste facing up. Prepare a template that matches the ...
16 Feb,2023
Reasons and Solutions for False Soldering in BGA Rework Machine when Replacing Graphics Card
1. Reasons for virtual soldering when replacing graphics card in BGA rework machine(1) Poor contact: Poor contact between the graphics card and the AGP slot on the motherboard is one of the reasons wh...
09 Feb,2023
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