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What Are the Product Specifications of SEAMARK's Hot Air BGA Rework Station?

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    Characteristics of a Hot Air BGA Rework Station


    The hot air BGA rework station is a specialized piece of equipment used for the repair and rework of electronic components, particularly suited to handling chips with BGA (Ball Grid Array) packaging. The hot air BGA rework station uses hot air as the heat source, blowing hot air onto the BGA package through a hot air gun or nozzle to achieve soldering. Its temperature rises relatively slowly and its thermal efficiency is relatively low, but it provides relatively uniform temperature control, making it suitable for temperature-sensitive components. It integrates various functions such as a hot air gun, preheating station, and electric soldering iron, enabling efficient heating and desoldering of BGA chips soldered onto motherboards or other electronic components. Due to its uniformity in temperature control, the hot air bga rework station is typically used in situations that require precise temperature control, especially in lead-free soldering environments, where it may provide nitrogen protection to prevent metal oxidation.

    SEAMARK's Hot Air BGA Rework Station Features


    SEAMARK is one of the leading BGA rework station suppliers and offers the following features in its hot air BGA rework stations.


    • Temperature curve setting.


    • High-definition touch screen operation allows real-time display and editing of temperature curves. Each set of temperature curves can be divided into 8 sections, and up to 100 sets of temperature curves can be stored, with an auto-temperature calibration feature.


    • Laser red dot positioning guidance.


    • Laser indication for PCB and component positioning.


    • Vacuum adsorption.


    • External vacuum pick-up tool for easy placement and removal of BGA.


    SEAMARK's Hot Air BGA Rework Station Specifications


    Power Supply


    AC220V±10% 50/60HZ


    Power


    5.0KW (maximum), Top Heater (0.8KW), Bottom Heater (1.2KW), Infrared Preheater (2.7KW), Others (0.3KW)


    PCB Size


    410*370mm (maximum); 10*10mm (minimum)


    BGA Chip Size


    40*40mm (maximum); 10*10mm (minimum)


    Infrared Heater Size


    375*285mm


    Operation Method


    High-definition touch screen


    Control System


    Proprietary heating control system V1


    Positioning System


    Laser dot


    Dimensions


    L635*W620*H655mm


    The Usage Precautions of Hot Air BGA Rework Station


    Safe Usage


    Ensure to follow safe operation procedures when using the hot air BGA rework station to ensure personal and equipment safety.


    Regular Maintenance


    Conduct regular cleaning and maintenance of the equipment to keep it in good condition.


    Professional Operation


    It is recommended that the equipment be operated by professional or trained personnel to ensure repair quality and equipment safety.

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    jackie@zhuomao.com.cn
    0086-0755-29929955
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