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Seamark ZM Technology Co., Ltd.

ZQ3500 Automated BGA De-soldering & Reballing Rework Line

The system provides fully automatic de-soldering and reballing capabilities and is compatible with multiple package sizes and solder ball diameters (0.3–0.76 mm).
The complete system integrates BGA rework processes including loading and unloading, vision alignment, de-soldering and adhesive removal, polishing, cleaning, flux printing, solder ball placement, AOI inspection, and sorting.

Features of ZQ3500 Automated BGA De-soldering & Reballing Rework Line

  • Fully Automated Rework Line

    Fully Automated Rework Line

    The complete system is a fully automated rework line, composed of multiple interconnected machines with human–machine control. Each process is equipped with corresponding sensors for operation monitoring and alarms to ensure stable, safe, and fully automated operation of the entire line.

  • Multi-Type Combined De-soldering System

    Multi-Type Combined De-soldering System

    De-soldering is performed with selectable process configurations using a lower preheating translation module combined with non-contact de-soldering nozzles of various sizes, an upper hot-air heating module, and a high-temperature resistant blade module.

  • Polishing & Cleaning System

    Polishing & Cleaning System

    After de-soldering, a high-speed polishing process with cleaning solution is applied to remove residual material from the de-soldered surface. The system is equipped with lint-free wipes to achieve fully automated post-de-soldering cleaning.

  • CCD Alignment

    CCD Alignment

    The system is equipped with multiple CCD units for handling and alignment, effectively ensuring high precision during loading and unloading processes.

Specification


ModelZQ3500
Equipment Performance ParametersOperation ModeFully Automatic
Material Feeding MethodLeft-in, Right-out Inline
BGA Product Sizemin:5mmx5mm max:100mmx100mm
Preheating Platform Temperature≤200°C (Adjustable)
Upper Air Zone / De-soldering Heater Temperature≤400°C (Adjustable)
De-soldering Residue≤15%
Changeover Time30min
Solder Ball Size0.3mm-0.76mm
Ball Placement AccuracyDeviation < 1/3 of ball diameter
Power SupplyAC:220±10%, 50/60HZ 1Φ
Module Repeat Positioning Accuracy±0.01mm
UPH≥10pcs
Equipment Dimensions4700 x 1500 (including display lane 2100) x 1850 mm (including three-color tower 2100)
Machine Weight5000KG
User Permission LevelsOperator / Maintenance / Engineer / Manager
Safety FeaturesAudible and visual alarms, alarm message display, emergency stop button, front acrylic door with magnetic protection, machine stops automatically if the door is opened during operation, leakage protection, reliable grounding


Contact Us
Welcome your presence, you can send us an email, we will get in touch with you within 24 hours.
F3, Building 11, Longwangmiao Industrial Zone, Baishixia Community, Fuyong, Bao'an, Shenzhen
jackie@zhuomao.com.cn
0086-0755-29929955
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