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Seamark ZM Technology Co., Ltd.

SP3100 Solder Paste Inspection System

SP3100 is a pre-programmed SMT solder paste printing Automatic Optical Inspection (AOI) system. It is equipped with a multi-angle RGBW illumination system, dual low-angle projection modules, a high-resolution industrial camera with a telecentric lens, and a high-precision automatic Z-axis module.

The system scans solder paste on the PCB surface using combined 2D + 3D inspection. By applying phase-shift technology, it generates three-dimensional contour data, enabling accurate measurement of solder paste height, volume, and area with micron-level precision, even under complex process conditions.

SP3100 delivers high-accuracy 3D automated inspection and can effectively detect defects such as excess solder, insufficient solder, missing print, solder bridging, exposed copper, and positional offset.


Features of SP3100 Solder Paste Inspection System

  • 3D Imaging Technology

    3D Imaging Technology

    High-precision 3D imaging technology with a dual low-angle projection system effectively minimizes shadowing and occlusion in fine-pitch components.

  • High-Speed Inspection

    High-Speed Inspection

    Equipped with a 12-megapixel high-resolution industrial camera (optional 21-megapixel), delivering high-clarity images to support high-speed inspection.

  • MES System Integration

    MES System Integration

    Supports integration with MES systems according to factory requirements.

  • Accurate Data Analysis

    Accurate Data Analysis

    Powerful SPC software provides comprehensive and precise statistical data analysis.

Specification

Inspection Items
ModelSP3100
Vision SystemImaging12MP industrial camera (21MP optional)
Resolution5μm/10μm/15μm
Inspection Speed8.6c㎡/s 34.3c㎡/s 77.1c㎡/s
IlluminationRGBW LED
HardwarePower Supply200V-230V AC 50/60Hz
Power Consumption2.2KW
Air Pressure0.4-0.6MPa
Weight1300KG
Machine Dimensions1100mm(L)*1350mm(W)*1630mm(H)
Inspection SpecificationsPCB Size510*460mm
PCB Thickness0.4-6mm
Edge Clearance3mm
PCB Clearance (Top/Bottom)45mm
Conveyor Height900±50mm
Measurement HeightComponents up to 2 mm in height
Defect DetectionExcess solder, insufficient solder, missing print, bridging, exposed copper, offset, etc.
Data Statistics & AnalysisStatistical Charts & Reports

Histogram, X-bar R/S charts, Cp/Cpk display, repeatability and reproducibility (R&R), daily/weekly/monthly/annual yield analysis

Optional FunctionsAuxiliary Features

Remote centralized review, barcode reading


Contact Us
Welcome your presence, you can send us an email, we will get in touch with you within 24 hours.
F3, Building 11, Longwangmiao Industrial Zone, Baishixia Community, Fuyong, Bao'an, Shenzhen
jackie@zhuomao.com.cn
0086-0755-29929955
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